News_Tensun Precision

With precision manufacturing, we embark on a new global journey!
2025-05-26
Precision Without Boundaries
Tensun to Showcase at SEMICON Southeast Asia 2025
2025-05-20
Precision Without Borders
Gratitude for the Journey, Advancing Together | Tensun Precision Dongguan Industrial Park Relocation Ceremony Successfully Concluded
2025-05-19
On April 19, 2025, the relocation ceremony of Tensun Precision (Dongguan) Industrial Park was grandly held in Xiegang, Dongguan. On this day, we declared to the industry through a grand celebration: Tensun Precision is advancing to new heights of global precision manufacturing with a grander vision and more advanced smart manufacturing capabilities.This relocation ceremony, themed &qu...
Advanced Packaging Grows Rapidly, Tensun Expands in Semiconductor Testing and Packaging
2025-05-19
The US announced the National Advanced Packaging Manufacturing Program, prioritizing materials and substrates for investment. As a key way to extend Moore's Law, advanced packaging is of great importance. With policy changes, the packaging capacity ratio at home and abroad will change. It's a chance as well as a challenge for everyone to fight for the dominant right.
Wafer-level Packaging Tech Drives Semiconductor Industry Growth
2025-05-13
Preface Per recent data from IDC and the MIIT, as of Feb 2024, shipment in emerging fields like smartphones and new energy vehicles has risen, boosting global semiconductor industry growth. The semiconductor packaging and testing sector is still moving towards miniaturization, integration, and low-power consumption. Advanced packaging forms like wafer-level packaging tech are becoming ...