TENSUN Precision Gains Recognition from OSAT Giant JCET Group

On September 17, at JCET Group’s 2026 Global Supplier Conference, TENSUN Precision was honored with the "Outstanding Emerging Supplier Award" for its technical strength and delivery performance in backend semiconductor packaging process equipment. This recognition is not only an affirmation of the stable operation of TENSUN’s core equipment such as the Jig‑...

vent Concluded! TENSUN Precision's Full‑Matrix Equipment Integrates into the Global Packaging Ecosystem

The three‑day industry event has successfully concluded. Centered on the theme “Transform Tomorrow”, SEMICON Taiwan 2026 wrapped up at Taipei Nangang Exhibition Center. Driven by the AI computing boom, advanced packaging, Chiplet, and 2.5D/3D heterogeneous integration stood out as key discussion topics. Industry peers from across the global supply chain gathered to explor...

Built on Solid Expertise | Tensun Precision Strip‑Grinding Equipment Achieves Volume Production

15‑Day Countdown

Only 15 days to go before SEMICON Taiwan 2026! From September 2‑4, Tensun Precision will make its full‑range debut with cutting, grinding, sorting and dispensing equipment at Booth P5812, Taipei Nangang Exhibition Center Hall 2.Leveraging our in‑house core technologies, we deliver one‑stop domestic solutions for advanced packaging. Colleagues from the global industry are ...

TENSUN Precision debuts its full four-process portfolio at SEMICON Taiwan 2026

SEMICON Taiwan 2026 September 2 – 4, 2026 1F, TaiNEX 2 P5812

Two Decades of Forging, Core-Driven for Distant Progress | Tensun Precision Grandly Concludes Its 20th Anniversary Celebration

Two Decades of Forging, Core-Driven for Distant Progress

Tensun Triumphs at SEMICON SEA 2026

DEDICATED TO PRECISION.

With precision manufacturing, we embark on a new global journey!

Precision Without Boundaries

Tensun to Showcase at SEMICON Southeast Asia 2025

Precision Without Borders

Gratitude for the Journey, Advancing Together | Tensun Precision Dongguan Industrial Park Relocation Ceremony Successfully Concluded

On April 19, 2025, the relocation ceremony of Tensun Precision (Dongguan) Industrial Park was grandly held in Xiegang, Dongguan. On this day, we declared to the industry through a grand celebration: Tensun Precision is advancing to new heights of global precision manufacturing with a grander vision and more advanced smart manufacturing capabilities.This relocation ceremony, themed &qu...

Advanced Packaging Grows Rapidly, Tensun Expands in Semiconductor Testing and Packaging

The US announced the National Advanced Packaging Manufacturing Program, prioritizing materials and substrates for investment. As a key way to extend Moore's Law, advanced packaging is of great importance. With policy changes, the packaging capacity ratio at home and abroad will change. It's a chance as well as a challenge for everyone to fight for the dominant right.

Wafer-level Packaging Tech Drives Semiconductor Industry Growth

Preface Per recent data from IDC and the MIIT, as of Feb 2024, shipment in emerging fields like smartphones and new energy vehicles has risen, boosting global semiconductor industry growth. The semiconductor packaging and testing sector is still moving towards miniaturization, integration, and low-power consumption. Advanced packaging forms like wafer-level packaging tech are becoming ...