Tensun Precision, established in July 2006, is committed to R&D, design, manufacturing, sales and service of precision dispensing and precision dicing equipment. Tensun Precision is headquartered in Shenzhen, with industrial park constructed in Dongguan. It currently has more than 400 employees with agents or offices in Chengdu, Taiwan region,South Korea, Singapore, Malaysia, and Thailand. Adhering to world-class quality standards and leading the industry development with preci-sion, professionalism, and quality. Tensun is now a partner of more than 50 leading domestic and international enterprises.

Since 2015, Tensun has successively delivered Tape Saw and Wafer Saw equipment, with cumulative sales of more than 1000 sets;

In 2022, Tensun introduced Jig Saw equip-ment, with self-developed and self-manufac-tured core cutting engine, visual sorting system and linear motor, which greatly improved the competitiveness of the product;

In 2023, Tensun launched Substrate/Wafer Dispensing, Lid Attach and other semiconduc-tor packaging dispensing solutions to further strengthen the service capabilities in the field of semiconductor packaging.

Tensun Precision is committed to the corpo-rate mission of transforming the world via precision manufacturing. Tensun continuous-ly focuses on R&D as well as the innovation of high-end precision equipment, with product lineup including dispensing, dicing, bending and custom-made equipment, which are applied in the semiconductor packaging and testing, AR/VR, Micro LED, OLED new display, and 3C consumer electronics manufacturing industry fields.