• SDS1210

SDS1210

Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.


Product Details Features Application occasions

Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.


System composition\project

unit

specification

Processing size

mm

280x280

Working platform size

mm

 

305 x305

 

X axis

 

work plan

mm

 

480

Cutting speed

mm/sec

 

0.05 400

 

Resolution

mm

0.0001

Y axis

 

work plan

mm

 

560

Resolution

mm

0.0001

Repeatability

mm

0.001/300

Z axis


work plan

mm

 

40 (2 inch blade)

Resolution

mm

0.0001

Θ axis

Rotation angle

deg

0-360

Spindle

power

KW

1.8 / 2.4

Rotating speed

rpm

5,000 - 60,000

 

Machine specifications

 

Power supply

V

3P, 220 (50~60 Hz)

 

Total power

KW

4

Air pressure

MPa

 

0.5~0.6

Air consumption

L/min

200

Cutting water consumption

L/min

4.0

Cooling water consumption

L/min

1.5

Dimensions

mm

11701160x1829

Total Weight

Kg

1200



It adopts LCD touch LCD for operation, the interface design is simple and easy to operate, and it is available in Chinese, English, Korean and other languages.

Square plate design, effective processing size 280 x 280 mm

Adopting high rigidity structure design to ensure high precision and high stability of cutting processing

Dual-spindle cutting at the same time, more than 85% higher than single-spindle cutting

Repeat positioning accuracy: 0.001 mm

Cutting speed: 0.05 ~ 400 mm/sec

Standard use of blade: 2 inch

With NCS (non-contact height measurement) function

Optional BBD (Blade Breakage Detection) function

Optional tool mark detection function


Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.