It adopts LCD touch LCD for operation, the interface design is simple and easy to operate, and it is available in Chinese, English, Korean and other languages.

Square plate design, effective processing size 280 x 280 mm

Adopting high rigidity structure design to ensure high precision and high stability of cutting processing

Dual-spindle cutting at the same time, more than 85% higher than single-spindle cutting

Repeat positioning accuracy: 0.001 mm

Cutting speed: 0.05 ~ 400 mm/sec

Standard use of blade: 2 inch

With NCS (non-contact height measurement) function

Optional BBD (Blade Breakage Detection) function

Optional tool mark detection function

Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.