Tensun Precision, established in July 2006.Committed to R&D, manufacture, service and sales precision dispensing machine and precision dicing machine, which used in semiconductor packaging, advanced display and 3C electronics. Tensun has became the most competitive brand in the dispensing and dicing field!

Since 2015, Tensun has successively deliver Tape Saw and Wafer Saw machine, with cumulative sales of more than 1000 sets;

In 2022, Tensun launch Jig Saw, with self developed and self manufactured core cutting engine, visual sorting system and linear motor, which greatly improving the competitiveness of the product;

In 2023, Tensun Precision launch substrate & wafer level dispensing system, Lid attach solution to further strengthen the service capabilities in semiconductor package area.

Tensun Precision currently has 500+ employees and with agents or offices in China, Taiwan, South Korea, Singapore, Malaysia and Thailand.