From September 2 to 4, SEMICON Taiwan 2026 will grandly take place at Taipei Nangang Exhibition Center. Centered around the theme "Transform Tomorrow", the show spotlights pivotal technologies including AI, advanced packaging and silicon photonics. Driven by robust AI demand, Taiwan’s IC packaging and testing industry maintains vigorous growth: its output value surged 27.3% year-on-year in Q1 2026, with both full-year packaging and testing output values projected to hit record highs, alongside continuous expansion of CoWoS production capacity.

As a national-level specialized, sophisticated, unique and innovative "Little Giant" enterprise, TENSUN Precision has devoted two decades to the development of high-precision manufacturing equipment. Supported by its modular self-developed technology platform, the company boasts a full-spectrum layout covering cutting, grinding, sorting and dispensing processes, built upon a unified hardware and software underlying platform and four standardized core process modules. Our solutions serve three major application sectors: semiconductor packaging, optical communication and high-precision electronics.

At this exhibition, TENSUN Precision will debut our complete equipment portfolio at Booth P5812, delivering one-stop solutions spanning process development through mass production delivery to the global semiconductor industry.