Used in LENS, VCM, CCM dispensing process and semiconductor chip package underfill dispensing process
This model is mainly developed for the double-head asynchronous dispensing process. It has the function of performing different dispensing actions with dual dispensing heads, and can work at the same time. It is suitable for dispensing different glues on the same product. It can be equipped with UV curing equipment, automatic loading and unloading equipment, and composition The entire automatic dispensing and curing assembly line.
Number of axes
Conveying track load
Applicable substrate thickness
LENS, VCM, CCM dispensing process
Semiconductor chip package underfill dispensing process