• Substrate Dispenser Sherpa900

Substrate Dispenser Sherpa900

Substrate Dispenser


Product Details Features Application occasions

Advantages

  • High precision&High stability platform, Integrate casting frame& Dual drive gantry structure with U-shaped linear motor, repeat-ability≤士5um.

  • Self-developed Piezo valve with various nozzle&needle configurations can meet differences application requirement.

  • Specially developed algorithm for underfill glue detection withfull or sampling inspection options to balancing productionquality and efficiency.

  • Tilt & Rotate options,provided optimal dispensing angle,minimum dispensing KOz 200um.

Applications

  • FCBGA/FCCSP/SIP package processSubstrate Flip-Chip Underfill.