• SD960H-2N

SD960H-2N

Used in LENS, VCM, CCM dispensing process and semiconductor chip package underfill dispensing process


Product Details Features Application occasions

This model is mainly developed for the double-head asynchronous dispensing process. It has the function of performing different dispensing actions with dual dispensing heads, and can work at the same time. It is suitable for dispensing different glues on the same product. It can be equipped with UV curing equipment, automatic loading and unloading equipment, and composition The entire automatic dispensing and curing assembly line.


Device model

SD960H-2N

Dimensions(WxDxH) 

3510x1252x740mm

Number of axes

6/10

Repeatability

X/Y:±0.005mm, Z:±0.01mm

Maximum speed

X/Y:1000mm/s, Z:350mm/s

Conveying track load

≤4kg

Applicable substrate thickness

0.5-7.5mm

Dispensing range

320/180mm




 


LENS, VCM, CCM dispensing process

Semiconductor chip package underfill dispensing process