From May 5 to 7, 2026, Tensun Precision exhibited at SEMICON Southeast Asia 2026 in Kuala Lumpur, Malaysia. The company showcased its cutting-edge solutions for advanced semiconductor packaging, drawing significant attention from industry professionals across the region.

First in China to develop and mass-produce Jig Saw, with 7 years of iteration and No.1 in sales.

FDS3210

Automatic Dual-Station Dicing and Sorting Machine

1) UPH>21K, minimum processing size 2×2mm

2) Integrated system: loading/unloading, dicing, tray handling, sorting and inspection

3) Applications: 

QFN/BGA/LGA/SiP/PCB/EMC leadframe

Pioneer of precision dispensing in China.

Pioneer of precision dispensing in China.

Sherpa900 

Substrate-Level Dispenser

• Repeatability ±3μm 

• Minimum dispensing KOZ (Keep Out Zone)

• Applications: FCBGA/FCCSP/SiP packaging processes; Substrate Flip-chip Underfill

Throughout the three-day exhibition, Tensun’s technical experts engaged in in-depth discussions with visitors. Many industry peers expressed strong interest in Tensun’s integrated solutions for CoWoS, 2.5D/3D packaging, and panel-level packaging - particularly the Jig Saw series and Underfill dispensing technology.

The successful conclusion of SEMICON SEA 2026 marks another milestone in Tensun’s globalization journey. Moving forward, Tensun will continue to deepen its presence in Southeast Asia - a key hub for semiconductor assembly and test (OSAT) - and provide local customers with world-class precision equipment and responsive services.