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Semi-automatic double knife cutting system SDS1210
Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.
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Deposition | Mask making/lithography | Etching | Ion implantation | Electroplating/grinding | Cutting/Packaging | Die attach | Wire bonding | Injection molding | Cutting test |
The cutting system is widely used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.
Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.
Shenzhen, China
