Precision Cutting Process Series SolutionsLED Packaging Dispensing Process Series Solutions

Precision Cutting Process Series Solutions

Precision Cutting Process Series Solutions

Precision Cutting Process Series Solutions

Semi-automatic double knife cutting system SDS1210

Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.


Solution supporting products

Process flow

Deposition

Mask making/lithography

Etching

Ion implantation

Electroplating/grinding

Cutting/Packaging

Die attach

Wire bonding

Injection molding

Cutting test


Application market

The cutting system is widely used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.


Solution supporting products

  • SDS1210

    SDS1210

    Used in precision cutting of semiconductor wafers, LED wafers & EMC lead frames, PCBs, sapphire glass, ceramic sheets and other materials.