• Sherpa91

Sherpa91

Used in SMT industry PCB, FPC, underfill and other dispensing processes and MiniLED, semiconductor packaging dispensing processes


Product Details Features Application occasions

This model is mainly developed based on the requirements of the SMT dispensing process. It adopts a casting frame structure, a manipulator mounted in a gantry structure, and a more efficient linear motor drive. The optional dual-line configuration can meet higher production requirements.


Device model

sherpa91

Dimensions(WxDxH) 

760x1320x1530mm

Number of axes

3/4/5

Repeatability

X/Y:±0.005mm, Z±0.005mm

Maximum speed

X/Y:1000mm/s, Z:500mm/s

Conveying track load

≤3kg

Applicable substrate thickness

0.5-10mm

Dispensing range X/Y 

Monorail350/480mm

Dual track350/200mm


SMT industry PCB, FPC, underfill and other dispensing processes

MiniLED, semiconductor packaging dispensing process