Used in SMT industry PCB, FPC, underfill and other dispensing processes and MiniLED, semiconductor packaging dispensing processes
This model is mainly developed based on the requirements of the SMT dispensing process. It adopts a casting frame structure, a manipulator mounted in a gantry structure, and a more efficient linear motor drive. The optional dual-line configuration can meet higher production requirements.
Number of axes
Conveying track load
Applicable substrate thickness
Dispensing range X/Y
SMT industry PCB, FPC, underfill and other dispensing processes
MiniLED, semiconductor packaging dispensing process