Join us at the SEMICON Southeast Asia 2025, the region's premier semiconductor event, from May 20-22 at Marina Bay Sands Expo and Convention Center, Singapore. Tensun Precision will exhibit at Booth 1713 in Hall B2, engaging with global industry players and experts.

Every Drop of Adhesive Reaches Future with Precision

Today, as the global semiconductor industry is being reshaped, Southeast Asia is rising as a new hub with its mature electronics manufacturing supply chain and strong R&D capabilities, becoming a key link in the global semiconductor.

At the expo, Tensun (Booth B1713) will unveil its latest semiconductor packaging and testing solutions. We'll explore new breakthroughs and trends in semiconductor manufacturing with global partners.

▎Precision Dicing Solutions

"At present, our cutting-edge technology can stably achieve ultra-small-size cutting of 2×2mm, with the UPH surpassing 21K. This fully satisfies customers' demands for high-precision and high-efficiency cutting." said the director of Tensun Precision Cutting Business Unit's solutions.

In semiconductor packaging, cutting-process accuracy and efficiency directly impact chip performance and cost. With years of technical accumulation, Tensun now offers full-series cutting solutions. They cover all-process requirements from wafer to single chip, helping customers handle diverse production challenges.

▎Precision Dispensing Solutions

In semiconductor packaging and testing, precision dispensing technology is crucial for chip reliability, heat dissipation, and final yield. Tensun, with its independent R&D capabilities, provides full-scenario dispensing solutions.

These cover key processes like wafer-level, substrate-level packaging, and Lid Attach heat-sink cover mounting, helping customers maximize accuracy and efficiency.

At Tensun, we believe that every drop of adhesive can shape the future. Our precision is our key to connecting with the world.

Exhibition Information Booth 1713, Hall B2

Join Us at the Exhibition!

Date: May 20–22, 2025

Venue: Booth 1713, Hall B2, Marina Bay Sands Expo and Convention Centre, Singapore

Let’s meet in Singapore to explore the future of semiconductor packaging and testing technology!