The three‑day industry event has successfully concluded. Centered on the theme “Transform Tomorrow”, SEMICON Taiwan 2026 wrapped up at Taipei Nangang Exhibition Center. Driven by the AI computing boom, advanced packaging, Chiplet, and 2.5D/3D heterogeneous integration stood out as key discussion topics. Industry peers from across the global supply chain gathered to explore the future evolution of the semiconductor sector.

At booth P5812, TENSUN Precision made its first full‑scale showcase of its complete equipment portfolio covering four core process technologies: dicing, Strip Grinding thinning, sorting, and high‑precision dispensing. This all‑in‑one solution for post‑processing advanced packaging targets high‑end applications including Fan‑out, SiP and CoWoS, addressing real‑world mass‑production pain points in OSAT fabs. It drew extensive in‑depth discussions with numerous OSAT manufacturers and industry specialists.